소형 진공 리플로우 VC 4
IGBT, MEMS, Mini LED, Micro LED, LED bare chip등 고품질 진공 솔더링을 위한 소형장비
Lab. QC, 신소재 개발, 산학연, 반도체 육성대학, 국가 연구기관등에 사용이 적합한 소형모델입니다.
NamA 의 리플로우 시스템
N2 질소 / Vacuum (Formic) 라인업
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25개이상의 발명 특허, 실용신안 특허 20건, 소프트웨어 특허, 디자인특허 SiC 은소결 장비 시리즈 . 웨이퍼 레벨의 포름산 진공 리플로우 솔더링
![](https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEgrKJj7OIP-ynmcfseXHAsoY-A3RwwLrZI1lfs-iMsejOpkoucsMeYTukVqFeCCtDPYqE7R0D83fVzsOdqmKHKu6xr6Aza8mqrq698nhz8oY5HV6Lr2J0tDFlxFeGiDf7vh-9Z01q5Bq-TDPXjW9pDmzfEPJWc9Mxa-UPuqqsAE0QQghviInJkPPvTuw-k/w400-h171/NamA_VC_work_01.jpg)
IGBT, MEMS 패키징, 고전력 부품, Micro LED, LED Bare chip등 널리 사용되는 장비.
![](https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEizo-HC1aBQ9bskMxOg3BJA-SdNdtR70xnVv2A6M-COa29LhkJjrcNamsllbj4J69Vh23O4i2T6j_7lGOESgfYeWw3CRfQnlSK1N8_4f5DF5BMIKBQ6eq9WvHPllId6V2N_MxpTi2DOYHttwmmQU-3tfwJqDUSx-NLF7asL_RDlTexAafZI9rLcDVaNhws/w400-h171/NamA_VC40_02.jpg)
3 Zone, 4 Zone Vacuum reflow 선택 가능 VCI 30/VCI 40
![](https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEhKj9qSO5sr3ovxBhWOflhrkvLmxT4eiiXET2-rG9G9JImRD7JFq4pAwotW36Z9EbT-TU_0VSEDkSsQOIPfLwpik3QvcQjnPPEDGc1-5iH0jISzSDCabZruDqMOP57UNmqkT-L7VGONu8-gxhHwomSVloaNzPQv71ePGQ6Rrd7Nw9AJUN0oNq-AbCMPvL4/w400-h171/NamA_VC4_05.jpg)
Easy Operating 가능한 운영 Menu
![](https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEihPB1UhFdgWwUcQZVsq-aDYiroF7DiJYcmWZN3KhoigUNscDbn_4ZNi9UtRd7DhZEA7skeqlbWScz499HR7HcC4HbGWmAOvgQerPEsRjPLpClkE6XSLJ24wOW5bXGyuOUd8LAfFDlTtLq3on_WnDdBw9xQIuJHto6c2-7S2rZetHytKkZzR6XHQEDDs-M/w400-h171/NamA_VC4_03.jpg)
Heating 열 전도율이 높은 IR 방식의 Heating
![](https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEjBzcRmP_kCuS6z_26BYsQ6se6OMdPm7KxuYo7R7DhZk029kjaNEIvEYQXackd_QfOyQQJg46b4LiUco9P73S_D8TQW2mu1zrUBRuTR6IV4BroCTVyxSQY1uSpunsM7nA8KcGzWjhmkpe3r9JWmH_lMWj045KT-DVA_yxqjDe63sLN8iFfVi2OvcD9-v2M/w400-h171/NamA_VC4_02.jpg)
설정온도에 빠르게 도달되는 고 파워 Heating 장비
Model |
VC 4 |
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Purpose |
In the above description |
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Soldering size |
400*300mm Height of Chamber :90mm. |
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Gas support |
N2,H2, H2/N2,HOCOOH. |
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Process support |
Preform solder / Paste |
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Oven size (LxWxH) |
1480*990*1300mm |
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Weight |
260kgs |
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Ultimate vacuum |
- Ultimate vacuum level :1 pa - Working vacuum level :according to the process demand - vacuum leak rate:15hours :0.5-1 Mbar - Type of vacuum detector: Helium leak detector - Vacuumizing time (from environment atmosphere to Vacuum 1 PA:5-10mins, to 5 Pa 90s. |
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90mm |
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Max Temperature |
450°C |
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Heating speed |
Fastest can reach to 2°C /S (Red copper heating plate / Optional: Red copper/Graphite/Graphite with SIC(on surface) ,The speed can according to the process demand to set. |
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Cooling speed |
Fastest can reach to 2°C /S, Chamber with cooling water circulate (The speed can according to the process demand to set.) |
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Lateral temperature difference |
±5℃ |
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Drawer loader weight |
20KG |
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Power |
Max:21.5KW ( Equipment start power) |
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Heating Plate |
Special treatment red copper platform (Optional: Red copper/Graphite/Graphite with SIC(on surface) |
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Power standard |
380V, 50HZ/60HZ,3-phase five-wire,10 square copper wire |
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Current |
3 x40 A |
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Control way |
Siemens PLC+IPC |