소형 진공 리플로우 VC 4
IGBT, MEMS, Mini LED, Micro LED, LED bare chip등 고품질 진공 솔더링을 위한 소형장비
Lab. QC, 신소재 개발, 산학연, 반도체 육성대학, 국가 연구기관등에 사용이 적합한 소형모델입니다.
NamA 의 리플로우 시스템
N2 질소 / Vacuum (Formic) 라인업
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25개이상의 발명 특허, 실용신안 특허 20건, 소프트웨어 특허, 디자인특허 SiC 은소결 장비 시리즈 . 웨이퍼 레벨의 포름산 진공 리플로우 솔더링
IGBT, MEMS 패키징, 고전력 부품, Micro LED, LED Bare chip등 널리 사용되는 장비.
3 Zone, 4 Zone Vacuum reflow 선택 가능 VCI 30/VCI 40
Easy Operating 가능한 운영 Menu
Heating 열 전도율이 높은 IR 방식의 Heating
설정온도에 빠르게 도달되는 고 파워 Heating 장비
Model |
VC 4 |
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Purpose |
In the above description |
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Soldering size |
400*300mm Height of Chamber :90mm. |
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Gas support |
N2,H2, H2/N2,HOCOOH. |
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Process support |
Preform solder / Paste |
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Oven size (LxWxH) |
1480*990*1300mm |
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Weight |
260kgs |
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Ultimate vacuum |
- Ultimate vacuum level :1 pa - Working vacuum level :according to the process demand - vacuum leak rate:15hours :0.5-1 Mbar - Type of vacuum detector: Helium leak detector - Vacuumizing time (from environment atmosphere to Vacuum 1 PA:5-10mins, to 5 Pa 90s. |
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|
90mm |
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Max Temperature |
450°C |
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Heating speed |
Fastest can reach to 2°C /S (Red copper heating plate / Optional: Red copper/Graphite/Graphite with SIC(on surface) ,The speed can according to the process demand to set. |
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Cooling speed |
Fastest can reach to 2°C /S, Chamber with cooling water circulate (The speed can according to the process demand to set.) |
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Lateral temperature difference |
±5℃ |
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Drawer loader weight |
20KG |
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Power |
Max:21.5KW ( Equipment start power) |
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Heating Plate |
Special treatment red copper platform (Optional: Red copper/Graphite/Graphite with SIC(on surface) |
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Power standard |
380V, 50HZ/60HZ,3-phase five-wire,10 square copper wire |
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Current |
3 x40 A |
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Control way |
Siemens PLC+IPC |