301 profilable batch reflow soldering system includes:
- Bench top oven measuring 690(L) x 480(W) x 280 mm(H)
- Front-loading heating chamber with working area of 250 x 200 mm
- Viewing window in front panel of heating chamber for visual inspection of reflow
- Combination infrared and forced-hot-Air convection heating.
- Microprocessor-controlled, multi-channel temperature control with ±2°C accuracy
- Android software platform and ultra-high-resolution touch screen display
- Programmable time and temperature for preheat, soak, reflow, and cooling
- Temperature control via heater zone thermocouple or on-board thermocouple
- Built-in, integrated WiFi for data transfer and networking
- 1 year parts warranty
301 vs 301N ( 질소) Batch Reflow Oven Specification | ||||
기능 및 모델 | 301 | 301N질소 | ||
1 | Solder type | Lead Free (SNPb) | N2 | |
2 | Heater Method | IR & Forced Hot Air Convection | ||
4 | User Interface | Android Software Platform Ultra High Resolution Touch Panel WiFi & Networking 7' touch screen LCD Display Build-in Dual core CPU | ||
5 | Table Size mm | 350 x 240 / Work : 250 x 200 | ||
6 | Temperature Rage | 310℃ Quarts IR & Forced Hot Air Convection Warm up time approx 2min | ||
7 | Temperature Precision | +.- 2 ℃ Real Time Temperature Profile Display | +.- 2 ℃ N2 Pressure 0,3MPa Flow rate 0 ~ 150L/min Same 301 | |
8 | 온도 Control | PID Control, SSR | ||
9 | Warm up time | Approx 3min | ||
10 | Power | 3.6Kw (avg) 6.3KW(Max) | ||
11 | Voltage | 220V Single Phase 50/60Hz | ||
12 | Exhaust | 6.3L/Min | ||
13 | Dimension(L.W.H) | 690 x 480 x 50mm | 780 x 560 x 370mm | |
14 | Weight | 60Kg | 82Kg |
온도 Step 구간 max 100 Point 설정 가능.